1.Establish requirements for semiconductor equipment systems and components
2.Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
3.Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings.
4.Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
5. Analyze designs developed – may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
6. Lead problem solving teams including root cause identification, brainstorming and conceptual development
7.Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
8.Provide on-job training (OJT) for other engineers
Qualifications
1.Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
2.Minimum of 12 years related engineering experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years’ experience; or equivalent experience
3.Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
4.Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
5.Strong skills and experiences in problem solving, time and priority management, communication, and project management
Preferred Qualifications
Semiconductor industry experience is not required, but a plus.
1.Establish requirements for semiconductor equipment systems and components
2.Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
3.Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings.
4.Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
5. Analyze designs developed – may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
6. Lead problem solving teams including root cause identification, brainstorming and conceptual development
7.Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
8.Provide on-job training (OJT) for other engineers
Qualifications
1.Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
2.Minimum of 12 years related engineering experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years’ experience; or equivalent experience
3.Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
4.Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
5.Strong skills and experiences in problem solving, time and priority management, communication, and project management
Preferred Qualifications
Semiconductor industry experience is not required, but a plus.
2022-05-21
Sr. Mechanical Engineering
上海
薪酬面议
职位描述:
Responsibilities
1.Establish requirements for semiconductor equipment systems and components
2.Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
3.Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings.
4.Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
5. Analyze designs developed – may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
6. Lead problem solving teams including root cause identification, brainstorming and conceptual development
7.Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
8.Provide on-job training (OJT) for other engineers
Qualifications
1.Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
2.Minimum of 12 years related engineering experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years’ experience; or equivalent experience
3.Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
4.Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
5.Strong skills and experiences in problem solving, time and priority management, communication, and project management
Preferred Qualifications
Semiconductor industry experience is not required, but a plus.
2022-05-21
工艺工程师(实习)
沈阳
薪酬面议
职位描述:
岗位职责:
负责编写IC产品从晶圆、封装测试的工艺开发与实施,包括:
1、开发12英寸晶圆的半导体薄膜(氧化硅、氮化硅、碳化硅等材料)等离子体化学气相沉积(Plasma Enhanced Chemical Vapor Deposition)工艺技术,不断改进和优化薄膜沉积工艺技术及薄膜材料性能;
2.使用、维护和管理薄膜材料的分析设备和仪器;
3.跟踪和掌握国内外12英寸半导体设备市场动态、半导体制备技术的最新状况与发展趋势,并进行新材料、新工艺、新技术的应用;
4.在理解和掌握半导体制造设备的功能与特点的基础上,制定、实施改进意见;
5.根据公司需要能够胜任在客户端的出差。